TSMC Unveils A14 Process at Technology Symposium to Advance the AI Future

TSMC continues to drive technology leadership at its 31^st Technology Symposium, themed "Advancing the AI Future," by unveiling its next cutting-edge logic process technology, A14, to global customers. Compared with the N2 process, A14 will offer up to 15% speed improvement at the same power, or up to 30% power reduction at the same speed, along with more than 20% increase in logic density. Production is planned to begin in 2028. Leveraging the Company's experience in design-technology co-optimization (DTCO) for nanosheet transistor, TSMC is also evolving its TSMC NanoFlex™ standard cell architecture to NanoFlex™ Pro, enabling greater performance, power efficiency, and design flexibility. In addition to A14, TSMC also debuted its latest industry-leading advanced logic, specialty technologies, and TSMC 3DFabric^® for advanced 3D chip stacking and packaging, equipping customers with a comprehensive suite of interconnected technologies to drive product innovation and continually advance the AI future. With both in-person and virtual events this year, TSMC topped last year's in-person attendance with more than 6,900 total visitors for symposiums in North America, Taiwan, Europe, Japan, and China, demonstrating continued strong customer support for the Company.

Empowering Ecosystem Partnership, Innovating for Everyday Life

TSMC is driving industry innovation and deepening ecosystem collaboration through its Technology Symposiums. This year, TSMC extended its "Automotive Forum" beyond the Europe symposium to Japan for the first time, where it hosted an "Automotive Panel." A total of 16 industry experts from both regions were invited to explore the latest technological developments and achievements in automotive technology.

At the same time, TSMC supports startup customers with the "Innovate with TSMC!" series of events, featuring two activities: the "Customer Pitch" and the "Innovation Zone." These events brought together customers, venture capitalists, and Open Innovation Platform® (OIP) partners to participate in this collaborative initiative. Now in its third year, "Innovate with TSMC!" expanded its venue from North America to Europe for the first time, with a total of 37 startup customers, 55 venture capital firms, and five OIP partners attending across the two regions. Startup customers showcased their technological highlights and development visions to potential partners through the "Customer Pitch," while the "Innovation Zone" displayed a series of end products. Through interactive engagement, the events facilitated technology exchanges, fostering resource integration and platform development to strengthen the innovation ecosystem. 

In addition, the "Demo of the Year Award," voted by attendees, was presented to Cerebras Systems in North America for its wafer scale engine (WSE). This ultra-large chip integrates four trillion transistors and 900,000 AI cores onto a 12-inch wafer, featuring 44GB of on-chip static random-access memory (SRAM). The WSE significantly enhances computational resource efficiency while achieving low latency, low power consumption, and cost advantages. In Europe, Axelera AI was awarded for its data center-level AI vision solutions driven by edge AI and ultra-low power technologies. Applications span across industries such as industrial monitoring, campus security, medical facilities, and financial institutions, showcasing the potential of AI in resource optimization and security upgrades.

Semiconductors are the cornerstone of technological innovation and societal progress. With the advent of the AI era, the integration of smart connectivity into every aspect of human life is accelerating, accompanied by rapidly-growing demand for energy-efficient computing. TSMC will continue to invest in semiconductor technology development, enhance advanced system integration services, deepen its commitment to green manufacturing, and expand its global manufacturing footprint. By collaborating with customers, TSMC aims to accelerate product innovation and create a more sustainable and better future.